A thermal management system consists
of materials designed to remove the heat generated by an
electronic device (such as a power transistor or a microprocessor)
to the ambient environment in order to ensure the reliable
operation of the system.
Saint-Gobain's Thermal Management
SolutionsSaint-Gobain
realizes that the competitive nature of today’s computer
assembly market requires automated mass production techniques.
That’s why our thermal management products are designed
to provide an effective path for heat dissipation with
minimal complication to the manufacturing process. In order
to accomplish this objective, Saint-Gobain utilizes over
50 years of tape manufacturing experience to design thermal
interfaces with creative materials and quality constructions
that will deliver maximum performance.
Maximum Thermal Performance in a
Cost-effective Form
Maximum thermal performance of a system is critical to optimize
the processing speed and the expected life of modern microprocessors,
and becomes even more crucial as the power of microprocessors and
the power density of computer assemblies continue to increase.
If a microprocessor is insufficiently cooled, it will operate at
speeds lower than it is capable of. In addition, when a microprocessor
is exposed to elevated temperatures for extended time periods,
its operating life will be decreased. Saint-Gobain allows designers
to incorporate the necessary thermal interface while keeping their
assembly costs to a minimum. This combination can produce a reliable
system at a very competitive cost.
